S3’s IP Targets Consumer, Wireless, Network and Digital Broadcast Applications
Santa Clara, California – September 10, 2007 – Silicon & Software Systems (S3), a world leading supplier of licensable mixed-signal intellectual property (IP), today announced the immediate availability of silicon results for its portfolio of high-performance, mixed-signal converter IP at the 65nm technology node. S3 is already delivering this IP to 2 of the top 10 global semiconductor companies.
The company will be presenting these new IP cores at the 2007 FSA Supplier’s Expo being held at the Santa Clara Convention Center on September 12th. S3’s extensive IP portfolio includes AFEs, ADCs, DACs and associated PLL components, optimized for integration into system ICs targeting consumer, wireless, network and digital broadcast applications. End markets served by existing S3 clients include WLAN, WiMAX, digital broadcast standards (e.g. DVB-T, DVB-S, DVB-C and DVB-H), High-Definition (HD) video applications and power-line communications.
“We have a deliberate strategy to address the needs of the high growth consumer applications market by broadening our IP portfolio at the 90nm, 65nm and lower technology nodes,” said Mike Murray, S3 General Manager, Mixed Signal IP. “S3’s first time success in migrating this high performance mixed signal converter IP portfolio to the 65nm node marks another industry first for S3 at this node.”
S3 is taping out solutions, integrating IP into single-chip systems, leveraging extensive design experience, and producing more than 35 SoC designs at the 90nm and 65nm process technology nodes. A major attraction for customers is
access to S3’s SoC integration engineering expertise in combination with silicon-proven IP. The advantage of a one-stop-shop for IP and design services at the 65nm node translates into clients having confidence that their product will meet exact market windows. S3 will discuss mixed-signal IP at advanced technology nodes, design services and the advantages of incorporating mixed-signal IP blocks into single-chip systems at the September 12th FSA Supplier Expo. S3 will be located at Booth #206 at the Santa Clara Convention Center.