As process technology nodes advance, falling costs & increasing capacity on older nodes enable OEMs embark on custom ASIC developments to take advantage of higher levels of integration thereby realizing significant BOM savings. Never before have mixed signal ASIC developments been within reach of so many, lower volume applications.
Choosing the right partner to realize the silicon development, in a cost effective and low risk manner, is still a challenge to be overcome by OEMs.
It is not only a technical challenge however, but also one of maximizing ROI. There are a number of system architecture choices to be made when moving from a discrete and ASSP based product to a custom SoC from CPU & memory architecture choice and software implications, to discrete RF, System in Package (SiP) to RF SoC, each with their own advantages technically and in terms of ROI.
This article discusses some of the challenges and opportunities addressed by S3 Group for our OEM Customers:
- Allow Product & Systems designers to reap the benefits of lower manufacturing costs on older process geometries
- Maximize feature benefits, by working with a partner with a strong understanding of all the system components and of the various technology options for implementation
- Developments are predicated on a strong and demonstrable business case
- S3 Group provides a one-stop shop to move from PowerPoint to packaged tested parts and into production